The Daniel Siegel Memorial Scholarship Fund
Purpose: To encourage talented science and engineering students to pursue careers in the packaging industry and to develop awareness of the industry, and of the TAPPI International Flexible Packaging and Extrusion Division.
This $4,000 scholarship is presented in even-numbered years, and will be awarded to a TAPPI Student Chapter member enrolled in a packaging or related major. The scholarship is funded by an endowment from MICA Corporation and the Siegel family. The International Flexible Packaging and Extrusion Division of TAPPI serves the interests of the industries relating to Flexible Packaging and Extrusion. Industries pertaining to these technologies include packaging, industrial films and laminations, blown and cast films extrusion, extrusion coatings and laminations, sheet extrusion and printing associated with these areas.
Special requirements: Applicants must demonstrate an interest in the technological areas covered by the International Flexible Packaging and Extrusion Division. To apply, click here to download the application. Review page 1 for deadline and other information. Select the "International Flexible Packaging and Extrusions Division, The Daniel Siegel Memorial Scholarship Fund" on page 5. Complete pages 6 through 9 before submitting. For more information, email Robert Dawson, IFPED Division Manager.
Division Technical Award
The Division Technical Award is intended to recognize outstanding accomplishments or contributions, which have advanced the industry's technology in the awarding division's field of interest.
Division Leadership and Service Award
The Division Leadership and Service Award is intended to recognize an individual for outstanding leadership and exceptional service to the awarding Division which have resulted in significant and demonstrable benefits to the Division's members.
All past International Flexible Packaging and Extrusion Division Award Winners